- multiple-layer metallization
- metalizacja wielopoziomowa
English-Polish dictionary of Electronics and Computer Science. 2013.
English-Polish dictionary of Electronics and Computer Science. 2013.
nanotechnology — /nan euh tek nol euh jee, nay neuh /, n. any technology on the scale of nanometers. [1987] * * * Manipulation of atoms, molecules, and materials to form structures on the scale of nanometres (billionths of a metre). These nanostructures typically … Universalium
Michael Francis Tompsett — is a British born physicist and former researcher at English Electric Valve Company, [1] who later moved to Bell Labs in America. He is best known as the inventor of Charge Coupled Device (CCD) Imagers used for imaging in devices such as digital… … Wikipedia
Memristor — Type Passive Working principle Memristance Invented Leon Chua (1971) First production HP Labs (2008) Electronic symbol … Wikipedia
Electromigration — is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current… … Wikipedia
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
printing — /prin ting/, n. 1. the art, process, or business of producing books, newspapers, etc., by impression from movable types, plates, etc. 2. the act of a person or thing that prints. 3. words, symbols, etc., in printed form. 4. printed material. 5.… … Universalium
Ferroelectric RAM — (FeRAM or FRAM [FeRAM is the accepted generic acronym for ferroelectric random access memory.] ) is a random access memory similar in construction to DRAM but uses a ferroelectric layer instead of a dielectric layer to achieve non volatility.… … Wikipedia
Itanium — 2 processor Produced From mid 2001 to present Common manufacturer(s) Intel Max. CPU c … Wikipedia
Modulating retro-reflector — A modulating retro reflector (MRR) system combines an optical retro reflector and an optical modulator to allow optical communications[1] and sometimes other functions such as programmable signage.[2] Free space optical communication technology… … Wikipedia
Evaporation (deposition) — Evaporation machine used for metallization at LAAS technological facility in Toulouse, France. Evaporation is a common method of thin film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel… … Wikipedia